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US Patent Issued to KOREA ATOMIC ENERGY RESEARCH INSTITUTE on Nov. 3 for "Semiconductor chip alignment apparatus and method for packaging" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,702, issued on Nov. 3, was assigned to KOREA ATOMIC ENERGY RESEARCH INSTITUTE (Daejeon, South Korea). "Semiconductor chip alignment apparatu... Read More


US Patent Issued to Movensys on Nov. 3 for "Automatic alignment of overhead transport vehicles to load ports of semiconductor fabrication tools" (Massachusetts Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,703, issued on Nov. 3, was assigned to Movensys Corp. (Somerville, Mass.). "Automatic alignment of overhead transport vehicles to load ports... Read More


US Patent Issued to Tokyo Electron on Nov. 3 for "Substrate processing apparatus and control position setting method" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,704, issued on Nov. 3, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing apparatus and control position setting method" was... Read More


US Patent Issued to NGK INSULATORS on Nov. 3 for "Member for semiconductor manufacturing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,705, issued on Nov. 3, was assigned to NGK INSULATORS Ltd. (Nagoya, Japan). "Member for semiconductor manufacturing apparatus" was invented ... Read More


US Patent Issued to Entegris on Nov. 3 for "Electrostatic chuck with reduced charge injection into dielectric layer" (Massachusetts Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,706, issued on Nov. 3, was assigned to Entegris Inc. (Billerica, Mass.). "Electrostatic chuck with reduced charge injection into dielectric ... Read More


US Patent Issued to BESI Switzerland on Nov. 3 for "Die ejector" (Swiss Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,707, issued on Nov. 3, was assigned to BESI Switzerland AG (Steinhausen, Switzerland). "Die ejector" was invented by Fabian Hurschler (Stein... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Adhesive tape sheet, method of manufacturing the same and method of manufacturing semiconductor devices using the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,708, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Adhesive tape sheet, method of manufacturing t... Read More


US Patent Issued to INNOX Advanced Materials on Nov. 3 for "Adhesive sheet for semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,709, issued on Nov. 3, was assigned to INNOX Advanced Materials Co. Ltd. (Asan-si, South Korea). "Adhesive sheet for semiconductor device" w... Read More


US Patent Issued to SCREEN HOLDINGS on Nov. 3 for "Substrate processing device and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,710, issued on Nov. 3, was assigned to SCREEN HOLDINGS Co. LTD. (Japan). "Substrate processing device and substrate processing method" was i... Read More


US Patent Issued to NITERRA on Nov. 3 for "Substrate holder and method of producing substrate holder" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,711, issued on Nov. 3, was assigned to NITERRA Co. LTD. (Nagoya, Japan). "Substrate holder and method of producing substrate holder" was inv... Read More